Title :
Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications
Author :
Pohlmann, W. ; Jacob, A.F. ; Schaefer, H. ; Hennemann, O.-D.
Author_Institution :
Fraunhofer-Inst. for Appl. Mater. Res., Bremen, Germany
Abstract :
A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeter wave assemblies. This paper discusses design and fabrication of such interconnects. A quasi-static model is developed to ease the quality assessment of their electrical behaviour. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibits low loss and is useable up to 50 GHz or more
Keywords :
MIMIC; MMIC; adhesives; conducting polymers; electric connectors; integrated circuit bonding; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; microstrip lines; microstrip resonators; 50 GHz; MIMIC; MMIC; adhesive bonded ribbons; chip-to-chip interconnect technique; conductive adhesive bonded ribbons; electrical behaviour; insertion loss; interconnect design; interconnect fabrication; interconnects; microstrip resonators; microstrip-to-microstrip interconnects; microwave applications; microwave assemblies; millimeter wave applications; millimeter wave assemblies; quality assessment; quasi-static model; wire bond interconnects; Assembly; Bonding; Conductive adhesives; Fabrication; Insertion loss; Microstrip; Millimeter wave measurements; Millimeter wave technology; Quality assessment; Wire;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742010
