Title :
In-plane micro-motion measurement with high accuracy based on computer microvision
Author :
Lu, Qinghua ; Fan, Yanbin ; Zhang, Xianmin
Author_Institution :
Dept. of Mechatron., Foshan Univ., Foshan
Abstract :
Micro-motion measurement with high accuracy plays a vital role in micro/nano manufacturing technology. In this paper, an integrated approach for measuring micro-motion that incorporates motion estimation algorithm into the computer microvision is proposed. At first, the basic principle of the computer microvision measurement is analyzed. Then, a robust multiscale motion estimation algorithm for micro-motion measurement is proposed. In this algorithm, according to the different properties of filters, motion at each level of the pyramid is estimated using different gradient filters. This hierarchical estimation technique not only provides an improvement in measurement accuracy, but also achieves measurement speedups. Finally, using the micropositioning stage as measurement objects, the micro-motions are measured using the integrated approach that incorporates this algorithm into computer microvision. The maximal bias of this integrated approach reached 12.5 nm for motions near 2000 nm. Experimental results show that the new integrated method can measure in-plane micro-motions with high accuracy.
Keywords :
manufacturing systems; micropositioning; motion estimation; motion measurement; nanofabrication; computer microvision measurement; gradient filters; in-plane micromotion measurement; micromanufacturing technology; micropositioning stage; nanomanufacturing technology; robust multiscale motion estimation algorithm; Biomedical computing; Biomedical measurements; Computer aided manufacturing; Mechanical variables measurement; Motion estimation; Motion measurement; Optical interferometry; Position measurement; Robustness; Velocity measurement; Micro-motion measurement; computer microvision; multiscale; robust;
Conference_Titel :
Intelligent Control and Automation, 2008. WCICA 2008. 7th World Congress on
Conference_Location :
Chongqing
Print_ISBN :
978-1-4244-2113-8
Electronic_ISBN :
978-1-4244-2114-5
DOI :
10.1109/WCICA.2008.4594473