Title :
Structure decomposition for hybrid analysis of multilayer interconnect systems
Author :
Orhanovic, Neven ; Divekar, Dileep ; Matsui, Norio
Author_Institution :
Appl. Simulation Technol., Inc., San Jose, CA, USA
Abstract :
A method for decomposing interconnect systems into signal propagation and power distribution parts is presented. The decomposed structure is amenable to hybrid analysis, where each part is analyzed using a separate analysis technique. The decomposition is performed around the discontinuities in the signal propagation paths.
Keywords :
SPICE; circuit simulation; equivalent circuits; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit packaging; multichip modules; printed circuit design; 3D FDTD-SPICE techniques; PCB; PDS; equivalent circuit models; integrated circuit interconnects; interconnect system hybrid analysis; interconnect systems structure decomposition; multichip modules; multilayer interconnect systems; power distribution elements; power distribution systems; signal propagation elements; signal propagation path discontinuities; Conductors; Dielectrics; Integrated circuit interconnections; Nonhomogeneous media; Power distribution; Power system interconnection; Power system modeling; Power systems; Printed circuits; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057900
