Title :
3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB
Author :
Kim, Tae Hong ; Lee, Junho ; Kim, Wyungsoo ; Kim, Joungho
Author_Institution :
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
A reliable electrical model of a ferrite bead used in a real application field is crucially required by EMI field engineers for proper design of power supply and noise isolation. Especially, the model is needed for the power/ground noise simulation of multi-layer PCBs. In this paper a precise high-frequency model of a ferrite bead is reported up to 3 GHz. The proposed model was successfully verified with excellent agreement to experiment in terms of magnitude and phase of S-parameters, and Smith chart.
Keywords :
S-parameters; circuit noise; electromagnetic interference; equivalent circuits; ferrite devices; interference suppression; modelling; printed circuit design; simulation; 3 GHz; EMI filtering; EMI reduction; S-parameters; SMD type chip bead; Smith chart; ferrite bead; high-frequency model; high-speed PCB; multilayer PCBs; power/ground noise simulation; precise HF model; Computational modeling; Computer simulation; Conducting materials; Conductors; Ferrites; Inductance; Magnetic resonance; Parasitic capacitance; Power system modeling; Resonant frequency;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057918
