Title :
Low Profile Glass Packaged Crystal Unit
Author :
Sato, M. ; Eguchi, H. ; Ishigami, S. ; Yamamoto, K.
Keywords :
Assembly; Ceramics; Costs; Crystalline materials; Electric shock; Glass; Packaging machines; Production; Sealing materials; Thermal expansion;
Conference_Titel :
39th Annual Symposium on Frequency Control. 1985
Conference_Location :
Philadelphia, Pennsylvania, USA
DOI :
10.1109/FREQ.1985.200867