Title :
Millimeter-wave broadband mode-transition between grounded coplanar waveguide and postwall waveguide
Author :
Hosono, Ryohei ; Uemichi, Yusuke ; Xu Han ; Ning Guan ; Nakatani, Yusuke
Author_Institution :
Fujikura Ltd., Chiba, Japan
Abstract :
In this paper, a broadband mode-transition between grounded coplanar waveguide (GCPW) and post-wall waveguide (PWW) is proposed. The transition is composed of GCPW, microstrip line (MSL) and PWW. The transition is fabricated on liquid crystal polymer (LCP) substrate due to its low dielectricity and availability of roll-to-roll process for fabrication of devices with cost reduction. The GCPW GSG pad has two through-holes at longitudinal direction and a rectangular slot are added in each pattern of ground pads. Broadband impedance matching is obtained by these structures thanks to an addition of lumped inductance and capacitance to the mode-transition. In the mode-transition between MSL to PWW, a shape of microstirp line is tapered and dimension is optimized for broadband operation. A 24% impedance bandwidth for |S11| less than -15 dB is achieved in measurement of fabricated mode-transition. Loss of GCPW GSG pad and MSL-PWW transition with 0.120 dB and 0.276 dB at 60 GHz are evaluated from measured results. This mode-transition is one of candidate for usage of low loss antenna-in-package with substrate at higher frequency band.
Keywords :
coplanar waveguides; cost reduction; electronics packaging; impedance matching; liquid crystal polymers; microstrip transitions; millimetre wave antennas; millimetre wave circuits; reliability; slot antennas; GCPW; LCP substrate; MSL; PWW; broadband impedance matching; cost reduction; frequency 60 GHz; gain 0.120 dB; gain 0.276 dB; grounded coplanar waveguide; liquid crystal polymer substrate; low loss antenna-in-package; microstrip line; microstrip transition; millimeter-wave broadband mode-transition; post-wall waveguide; rectangular slot; roll-to-roll process; Broadband antennas; Broadband communication; Coplanar waveguides; Insertion loss; Loss measurement; Substrates; Transmission line measurements; Antenna-in-package; Broadband mode-transition; GCPW GSG pad; LCP substrate; Lumped impedance matching;
Conference_Titel :
Antennas and Propagation (ISAP), 2014 International Symposium on
Conference_Location :
Kaohsiung
DOI :
10.1109/ISANP.2014.7026610