DocumentCode
2506830
Title
A simplified thermodynamic model for waste heat utilization from a containerized data center experimental platform
Author
Ward, Eric M. ; Goedke, Matthew L., Jr. ; Brenner, Paul ; Go, David B.
Author_Institution
Dept. of Aerosp. & Mech. Eng., Univ. of Notre Dame, Notre Dame, IN, USA
fYear
2012
fDate
May 30 2012-June 1 2012
Firstpage
521
Lastpage
529
Abstract
Environmentally Opportunistic Computing is an approach to use the waste heat from containerized data center nodes to offset the heating needs of adjacent buildings or facilities. The computational load is then distributed across a number of data center nodes based on where the waste heat is required. In this work, a prototype data center node that houses three racks of servers and is ducted to a local greenhouse is examined. Using a free cooling approach, ambient air is pulled into the container (cold aisle) to cool the servers and the warm air on the backside of the servers (hot aisle) is directly expelled into the greenhouse as space heat to offset heating costs during the fall, winter, and spring months, while during hotter summer months, the heat is directly expelled to ambient. Experimental measurements demonstrate the functionality of the prototype, and a first order thermodynamic model of the containerized data center is developed to predict the temperature conditions in both the hot aisle and cold aisle under various operating conditions. The solution to the model has been calibrated and validated against temperature measurements taken in the containerized data center, and evaluation of the model reveals key parameters that impact performance and design.
Keywords
air pollution control; computer centres; space cooling; space heating; thermodynamics; waste heat; ambient air; containerized data center experimental platform; containerized data center nodes; environmentally opportunistic computing; free cooling approach; local greenhouse; offset heating costs; servers rack; simplified thermodynamic model; space heating; temperature conditions; temperature measurements; waste heat utilization; Green products; Heating; Prototypes; Servers; Temperature measurement; Temperature sensors; Waste heat; data center; energy harvesting; thermodynamic model; waste heat;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
978-1-4244-9533-7
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2012.6231475
Filename
6231475
Link To Document