Reliability of column/board/CCGA attachment

Author

Ghaffarian, Reza

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

fYear

2012

fDate

May 30 2012-June 1 2012

Firstpage

619

Lastpage

627

Abstract

Commercial-off-the-shelf column grid array packaging (COTS CCGA) technologies are now being considered for use in a number of high reliability applications. This paper presents rework and re-column attachment of two high input/output (I/O) CCGA (CGA) packages (1144 and 560 I/Os): Subsequent to re-column attachment and isothermal aging, the integrity of tin-lead solder-column attachment was determined and presented. In addition, the process-control parameters for assembly of re-columned CGA packages using either vapor-phase or rework stations were established for both package types/sizes. Details of these process control parameters as well as quality assurance indicators based on visual inspection before and during thermal cycling tests are presented. Qualification guidelines generated based on these and additional optical photomicrographs, X-rays, SEMs, and destructive cross-sectioning of thermally cycled, reworked, re-columned, and re-assembled test vehicles of these CGAs are presented in detail.

Keywords

X-ray diffraction; ageing; ball grid arrays; inspection; lead alloys; process control; quality assurance; reliability; scanning electron microscopy; solders; tin alloys; COTS CCGA technology; I/O CCGA CGA packages; SEM; SnPb; X-ray diffraction; column-board-CCGA attachment reliability; commercial-off-the-shelf column grid array packaging; destructive cross-sectioning; high input-output packages; isothermal aging; optical photomicrographs; process control parameters; quality assurance indicators; reassembled test vehicles; recolumn attachment; thermal cycling tests; tin-lead solder-column attachment integrity; visual inspection; Aging; Arrays; Isothermal processes; Reliability; Soldering; X-rays; CCGA; CGA; Column grid array; recolumn; rework; solder joint reliability; thermal tests;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on

Conference_Location

San Diego, CA

ISSN

1087-9870

Print_ISBN

978-1-4244-9533-7

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2012.6231486

Filename

6231486