DocumentCode :
2507323
Title :
Heat transfer and pressure drop characterization of a tubular evaporator using manifold on the microgrooved surfaces
Author :
Jha, V. ; Dessiatoun, S. ; Ohadi, M.
Author_Institution :
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
732
Lastpage :
739
Abstract :
Miniaturization of heat and mass exchanger is needed for increasing COP and energy efficiency. For small scale systems where ample of waste heat is available, huge initial cost for absorption chillers becomes a deterrent. The paper talks about development of a tubular evaporator based on manifold microchannel systems and the results associated with microgroove surface made of aluminum. Manifold guided flow has been utilized on micro-grooved structure of high aspect ratio channels. Aluminum surface channel width is 60 microns and channel height is close to 600 microns. Two different components - one based on force fed and other plain tube insert has been tested on water side for getting enhanced water side heat transfer coefficients. The results would be discussed for wide variation for refrigerant side and water side mass flow rates. Very high overall heat transfer coefficient more than 20,000 W/m2-k has been achieved using plain tube insert on water side of the evaporator with a modest pressure drop close to 100 mbars. Cooling capacity more than 4KW has been achieved too.
Keywords :
cooling; heat exchangers; heat transfer; microchannel flow; refrigerants; waste heat; COP; absorption chillers; aluminum surface channel; coefficient of performance; cooling capacity; energy efficiency; enhanced water side heat transfer coefficients; heat exchanger miniaturization; heat transfer characterization; high aspect ratio channels; manifold guided flow; manifold microchannel systems; mass exchanger; microgrooved surfaces; plain tube; pressure drop characterization; refrigerant; size 60 micron; tubular evaporator; waste heat; water side mass flow rates; Heat transfer; Manifolds; Refrigerants; Temperature measurement; Waste heat; Water heating; Absorption refrigeration; Tubular evaporator; micro channels; micro cooling; waste heat recovery;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231500
Filename :
6231500
Link To Document :
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