Title :
Thermal strain measurement of a double ring structure using digital image correlation method
Author :
Jin, Tailie ; Goo, Nam Seo ; Kim, Won-Seop ; Lee, Jinho
Author_Institution :
Dept. of Adv. Technol. Fusion, Konkuk Univ., Seoul, South Korea
fDate :
May 30 2012-June 1 2012
Abstract :
Thermal output is a source of large error in the thermal deformation measurement of specimens under temperature change when a strain gauge is used. In this study, the digital image correlation (DIC) method is employed to measure the full-field thermal deformation and strain of a double ring structure consisting of an inner aluminum ring and an outer titanium ring. The thermal deformation of the ring was measured up to 200 degrees C and the heating condition of the double ring structure was analyzed by finite element simulation. The results confirm that the deformation and strain fields obtained from the DIC method were in good agreement with the analysis result.
Keywords :
finite element analysis; heating; strain measurement; DIC method; digital image correlation method; double ring structure; double ring structure strain; finite element simulation; full-field thermal deformation; heating condition; inner aluminum ring; outer titanium ring; temperature change; thermal deformation measurement; thermal output; thermal strain measurement; Correlation; Finite element methods; Strain; Strain measurement; Structural rings; Temperature measurement; Titanium; ARAMIS; Digital Image Correlation; Double ring structure; Thermal output;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231536
