Title :
Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN
Author :
Bozorg-Grayeli, Elah ; Li, Zijian ; Gambin, Vincent ; Asheghi, Mehdi ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
fDate :
May 30 2012-June 1 2012
Abstract :
Due to their high thermal conductivity, diamond substrates are seen as a way to minimize the thermal resistance present in High Electron Mobility Transistor (HEMT) structures based on GaN. Single-crystal AlN transition layers facilitate the growth of high quality GaN on diamond, but such layers may increase the total thermal resistance of the composite substrate. This manuscript measures the thermal conductivity and interface resistance of a 1.4 μm diamond film on a polycrystalline AlN substrate using picosecond time-domain thermoreflectance (TDTR) and nanosecond thermoreflectance. Varying beam widths are used to extract the thermal conductivity anisotropy of the diamond film.
Keywords :
III-V semiconductors; aluminium compounds; diamond; gallium compounds; high electron mobility transistors; thermal conductivity; thermal resistance; thermoreflectance; wide band gap semiconductors; AlN; C; GaN; HEMT structures; TDTR; beam widths; composite substrate; diamond film; diamond substrates; high electron mobility transistor; interface resistances; nanosecond thermoreflectance; picosecond time-domain thermoreflectance; polycrystalline substrate; single-crystal transition layers; size 1.4 mum; thermal conductivity anisotropy; total thermal resistance; Conductivity; Diamond-like carbon; Gallium nitride; Logic gates; Resistance; Substrates; Thermal conductivity; Aluminum nitride; High Electron Mobility Transistors (HEMT); Thermal Boundary Resistance (TBR); Time-Domain Thermoreflectance (TDTR); diamond; thermal conductivity;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231541