Title :
Thermal characterization of a 149-lead VLSI package with heat sink
Author :
Wesling, Paul B.
Author_Institution :
Tandem Computers Inc., Cupertino, CA, USA
Abstract :
High-power emitter-coupled logic (ECL) circuits in large pin-grid array (PGA) packages must be optimized for thermal dissipation in order to operate reliably in computer applications. The steady-state and dynamic thermal characteristics of a 149-lead hermetic PGA package are studied, with emphasis on three different configurations of a finned heat sink and on two types of fillers for the epoxy heat-sink-attach adhesive. The package described has high thermal performance in an air-cooled regime. Data are presented showing thermal resistance from junction to ambient as a function of number of heatsink fins and composition of heatsink-attach epoxy. At nominal conditions, thermal resistance (junction-to-ambient) of the selected five-fin heatsink and aluminum-filled epoxy adhesive is less than 6°C/W at an airflow of 500 linear feet per minute. Also discussed is the junction-to-case thermal resistance, measured as per SEMI Standard G30-86. A value of 1.2°C/W was measured for the package
Keywords :
VLSI; adhesion; emitter-coupled logic; heat sinks; integrated logic circuits; packaging; plastics; thermal resistance; thermal variables measurement; ECL circuits; SEMI Standard G30-86; air-cooled regime; dynamic thermal characteristics; epoxy heat-sink-attach adhesive; fillers; finned heat sink; junction-to-case thermal resistance; pin-grid array package; steady state characteristics; thermal dissipation; thermal performance; Computer applications; Electrical resistance measurement; Electronics packaging; Heat sinks; Logic arrays; Logic circuits; Resistance heating; Steady-state; Thermal resistance; Very large scale integration;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA
DOI :
10.1109/SEMTHE.1988.10598
