Title :
Equivalent circuit modeling of signal vias considering their return current paths
Author :
Ndip, Ivan ; Ohnimus, Florian ; Löbbicke, Kai ; Tschoban, Christian ; Bierwirth, Micha ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution :
IZM, Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
Abstract :
A circuit model for signal vias, considering their return-current paths in five-layered stack-ups, is proposed. Closed-form expressions for the computation of via capacitance are derived and used together with conventional formulas for inductance and resistance computations to accurately account for the RF behaviour of the vias over a wide range of frequencies.
Keywords :
capacitance; electric resistance; electronic engineering computing; inductance; integrated circuit modelling; RF behaviour; capacitance computation; closed form expression; equivalent circuit modeling; five-layered stack-ups; inductance computation; resistance computation; return current paths; Capacitors; Dielectric substrates; Electromagnetic interference; Electromagnetic modeling; Electromagnetic radiation; Equivalent circuits; Frequency; Integrated circuit interconnections; Microstrip; Packaging;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
DOI :
10.1109/APEMC.2010.5475699