DocumentCode :
2514776
Title :
Advanced modeling and simulation methodologies for signal integrity analysis
Author :
Achar, Ram
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, ON
fYear :
2008
fDate :
21-24 Nov. 2008
Firstpage :
279
Lastpage :
279
Abstract :
The intense drive for signal integrity has been at the forefront of rapid and new development in CAD algorithms. With increasing demands for high signal speeds coupled with decreasing feature sizes, interconnect effects such as signal delay, distortion and crosstalk become the dominant factors limiting overall performance of high-speed systems. On the other hand, interconnect structures can be diverse and present at any of the hierarchical packaging levels including integrated circuits, printed circuit boards, multi-chip modules and backplanes. If not considered during the design stage, interconnect effects can cause failed designs. Since extra iterations in the design cycle are costly, accurate prediction of these effects is a necessity in high-speed designs. Although conventional CAD tools such as SPICE are used routinely by many engineers for analog simulation and general circuit analysis, these tools do not handle adequately the new emerging challenges of interconnect effects. In this talk, high-frequency issues and signal integrity in high-speed designs will be discussed. Advanced interconnect modeling/simulation strategies with emphasis on distributed large coupled transmission line networks will be presented. Various levels of interconnect modeling will be considered and the applications cover wide spectrum of on-chip, multichip, packages, printed circuit boards, backplanes/connectors.
Keywords :
coupled transmission lines; CAD algorithms; SPICE; distributed large coupled transmission line networks; general circuit analysis; hierarchical packaging levels; integrated circuits; interconnect effects; modeling-simulation methodologies; multi-chip modules; printed circuit boards; signal delay; signal distortion; signal integrity analysis; Analytical models; Backplanes; Circuit simulation; Coupling circuits; Delay effects; Distortion; Integrated circuit interconnections; Packaging; Printed circuits; Signal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Recent Advances in Microwave Theory and Applications, 2008. MICROWAVE 2008. International Conference on
Conference_Location :
Jaipur
Print_ISBN :
978-1-4244-2690-4
Electronic_ISBN :
978-1-4244-2691-1
Type :
conf
DOI :
10.1109/AMTA.2008.4763259
Filename :
4763259
Link To Document :
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