DocumentCode :
2517835
Title :
A new Embedded Packaging Technology for high power LEDs
Author :
De Samber, Marc ; Ackerveken, Ton V d ; Burghoom, Marieke ; Bruinsma, Nienke ; Van Grunsven, Eric
Author_Institution :
Philips Appl. Technol., Eindhoven, Netherlands
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
242
Lastpage :
248
Abstract :
A new wafer level packaging concept for a multi-color Light Emitting Diode (LED) lighting device is suggested and demonstrated. The concept tackles 2 major challenges in high power LED packaging: optical out-coupling and high operating temperatures. The standard way of forming an optical package is based on assembling LEDs onto a substrate and subsequently mounting an optical body (e.g., a lens) onto the LEDs afterwards. The method proposed here is a reverse order method, meaning, first mounting the LEDs inside an optical body and next forming the electrical connections. The use of high temperature resistive materials holds the promise of using the device at high operating temperatures and the embedded optical coupling maximizes the light emission efficiency of these devices.
Keywords :
assembling; light emitting diodes; wafer level packaging; assembling; embedded packaging technology; high power LED packaging; light emission efficiency; lighting device; multi-color light emitting diode; optical body; optical out-coupling; optical package; wafer level packaging; Assembly; LED lamps; Lenses; Light emitting diodes; Optical coupling; Optical materials; Packaging; Stimulated emission; Temperature; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763441
Filename :
4763441
Link To Document :
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