DocumentCode :
2518224
Title :
Process Development and Reliability of Microbumps
Author :
Pei-Siang, Sharon Lim ; Rao, Vempati Srinivasa ; Yin, Hnin Wai ; Ching, Wai Leong ; Kripesh, V. ; Lee, Charles ; Lau, John ; Milla, Juan ; Fenner, Andy
Author_Institution :
Inst. of Microelectron., A STAR, Singapore, Singapore
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
367
Lastpage :
372
Abstract :
The use of flip chip bonding technology on AuSn microbumps for flip chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip chip technology are suitability for very fine pitch interconnection, low assembly cost and fluxless bonding. Fluxless flip chip assembly is in demand especially for medical applications and optoelectonics packaging. Here, we report the assembly process development of a silicon stacked module assembled with AuSn microbumps to meet the stringent reliability. The effects of bond pressure distribution, bond temperature and alignment accuracy were found to be critical in this stacked silicon using AuSn microbumps. A three-factor design of experiment (DOE) was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on contact resistance and AuSn solder wetting on the eNiAu UBM. Results showed that higher bond force is undesirable and contributes to passivation cracking and deformed AuSn joint with AuSn solder being squeezed out of the joint during bonding. The reliability result of the flip chip assembly of stacked silicon module using AuSn microbumps was presented.
Keywords :
bonding processes; chip scale packaging; cracks; deformation; design of experiments; elemental semiconductors; flip-chip devices; gold alloys; micromechanical devices; reliability; silicon; tin alloys; wetting; AuSn-Si; alignment accuracy; bond pressure distribution; bond temperature; contact resistance; deformation; design of experiment; flip chip bonding; flip chip packaging; fluxless flip chip assembly; microbumps; passivation cracking; process development; reliability; silicon stacked module; wetting; Assembly systems; Biomedical equipment; Bonding forces; Costs; Electronics industry; Electronics packaging; Flip chip; Medical services; Silicon; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763462
Filename :
4763462
Link To Document :
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