• DocumentCode
    2518445
  • Title

    Finite Element Analysis of Alternating Phase-Shift Masks Subjected to Dynamic Pressure Loading Due to Megasonic Cleaning

  • Author

    Yin, X. ; Komvopoulos, K.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    435
  • Lastpage
    443
  • Abstract
    The mechanical response of alternating phase-shift mask (APSM) microstructures to dynamic pressure loading during megasonic cleaning was analyzed with the finite element method (FEM). A parametric study of the effects of microstructure dimensions, pressure amplitude, and loading frequency on the mask structural integrity was performed for two typical chromium/quartz APSM patterns. Damage due to microfracture and plastic deformation processes encountered during megasonic cleaning was examined for frequencies of 1, 5, and 10 MHz. FEM results provide insight into possible damage modes and critical microstructure dimensions for catastrophic failure. Damage scenarios revealed by FEM results are in qualitative agreement with experimental observations. The results of this study have direct implications in the design of extreme ultraviolet lithography masks and the optimization of the megasonic cleaning process.
  • Keywords
    chromium; finite element analysis; fracture; micromechanics; phase shifting masks; plastic deformation; quartz; ultrasonic cleaning; Cu-SiO2; FEM; alternating phase-shift mask microstructures; dynamic pressure loading; extreme ultraviolet lithography; finite element analysis; frequency 1 MHz; frequency 10 MHz; frequency 5 MHz; mask structural integrity; mechanical response; megasonic cleaning; microfracture; plastic deformation; Chromium; Cleaning; Design optimization; Finite element methods; Frequency; Lithography; Microstructure; Parametric study; Plastics; Ultraviolet sources;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763473
  • Filename
    4763473