In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

Author

Herkommer, Dominik ; Reid, Michael ; Punch, Jeff

Author_Institution

Stokes Inst., Univ. of Limerick, Limerick, Ireland

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

506

Lastpage

515

Abstract

In this paper the creep behaviour of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs have been conducted. The tests were observed in-situ with a high magnification camera system. The quantitative data gained from the tests was used to fit an Anand viscoplastic model. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence of the test conditions.

Keywords

copper alloys; creep; shear deformation; silver alloys; solders; stress-strain relations; tin alloys; viscoplasticity; Anand viscoplastic model; SnAgCu; hypo-eutectic solder; joint-scale solder; optical creep; rumpling; shear bands; strain; surface effects; voiding; Assembly; Capacitive sensors; Creep; Electronic equipment testing; Environmentally friendly manufacturing techniques; Lead; Life testing; Materials testing; Stress; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763484

Filename

4763484