Title :
Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print
Author_Institution :
Indium Corp., Clinton, NY, USA
Abstract :
Miniaturization results in excessive oxidation for reflow soldering applications. Approaches for enhancing the oxidation barrier restricts the potential for improvement due to the difficulty of concurrent solder paste deposition. A new lead-free no-clean paste Indium 8.9ATG has been developed, which provides both superior anti-oxidation and printing performance. The flux technology developed also brings in other improvement such as low voiding.
Keywords :
oxidation; printing; soldering; anti-oxidation; flux technology; low voiding; oxidation barrier; paste indium 8.9ATG; printing; reflow soldering; solder paste deposition; Atmosphere; Costs; Environmentally friendly manufacturing techniques; Heating; Indium; Lead; Oxidation; Printing; Reflow soldering; Surface-mount technology; SIR; SMT; flux; graping; oxidation; print; reflow; solder; solder paste; soldering; voiding;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763494
