Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2)

Author

Lin, Ta-Hsuan ; Andros, Frank ; Lu, Siyu ; Sammakia, Bahgat

Author_Institution

Dept. of Syst. Sci. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1316

Lastpage

1320

Abstract

This paper addresses a new flip chip interconnect technique - Flexible Flip Chip Connection (F2C2) technology and its initial reliability study. F2C2 utilizes copper columns instead of solder balls as the electrical and mechanical interconnections between the semiconductor chip and the substrate. In this study, Accelerated Thermal Cycling (ATC) tests were performed on F2C2 components as well as C4 and underfill C4 components in an air-to-air thermal shock chamber. The test results were assessed and compared.

Keywords

flip-chip devices; integrated circuit interconnections; integrated circuit reliability; monolithic integrated circuits; thermal shock; accelerated thermal cycling; air-to-air thermal shock chamber; copper column flexible flip chip connection; electrical interconnections; mechanical interconnections; reliability; semiconductor chip; Assembly; Copper; Fatigue; Flip chip; Packaging; Substrates; Testing; Thermal stresses; Vehicles; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763613

Filename

4763613