Title :
An introduction to area array probing
Author :
Taber, Frederick L., Jr.
Author_Institution :
IBM Corp., USA
Abstract :
The semiconductor industry´s move to area array I/O wafers is accelerating, demanding that wafer probe professionals become knowledgeable with the considerations and techniques for probing these wafers. Area array probing has been practised within ISM for over two decades. From that experience, this overview will provide an awareness of the factors, techniques and methods associated with array area probing
Keywords :
ceramic packaging; chip scale packaging; integrated circuit testing; production testing; reflow soldering; reviews; COBRA probe; area array I/O wafers; area array probing; ceramic package; pin grid array; reflow solder bump; vertical probe market growth; wafer probes; Acceleration; Ceramics; Circuits; History; Packaging; Probes; Semiconductor device manufacture; Space technology; Testing; Wire;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743164
