DocumentCode
252520
Title
Effect of lead frame design and thickness of Dual Row Quad Flat No Lead Package (DR-QFN)
Author
Tuan Yaakub, Tuan Norjihan ; Beeran Kutty, Suhaili ; Mohamad Maksom, Nur Atiqah
Author_Institution
Fac. of Electr. Eng., Univ. Teknol. MARA Malaysia, Shah Alam, Malaysia
fYear
2014
fDate
11-12 Aug. 2014
Firstpage
1
Lastpage
6
Abstract
This study presents the thermo-mechanical stress characteristic of the Dual Row Quad Flat No Lead (DR-QFN) of a 44 lead DR-QFN package with staggered lead frame design and 48 lead DR-QFN package with inline lead frame design. The steady-state structural analysis for DR-QFN package with different lead frame design is performed using ANSYS software. The stress behavior of DR-QFN package with different lead frame thickness also been presented in this study. The 3D models used in this study were developed using finite element method with SOLID 70 and MESH 200 element types. From the study, results show that thinner lead frame gives smaller value of stress. DR-QFN package with lead frame thickness of 0.15 mm has 6% smaller value of stress compared to package with lead frame thickness of 0.20 mm. For lead frame configuration analysis in the DR-QFN package, both staggered and inline lead frame design, show no significant differences in terms of displacement and stress value. As a conclusion the stress can be reduced by using thinner lead frame.
Keywords
electronics packaging; finite element analysis; thermal stresses; ANSYS software; DR-QFN; MESH 200 element type; SOLID 70 element type; dual row quad flat no lead package; finite element method; inline lead frame design; lead frame configuration analysis; size 0.15 mm; size 0.20 mm; staggered lead frame design; steady-state structural analysis; thermomechanical stress; Finite element analysis; Load modeling; Loading; Solid modeling; Stress; Thermal stresses; Three-dimensional displays; QFN; design; dual row; finite element method; leadframe;
fLanguage
English
Publisher
ieee
Conference_Titel
Control and System Graduate Research Colloquium (ICSGRC), 2014 IEEE 5th
Conference_Location
Shah Alam
Print_ISBN
978-1-4799-5691-3
Type
conf
DOI
10.1109/ICSGRC.2014.6908686
Filename
6908686
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