MEMS fault model generation using CARAMEL

Author

Kolpekwar, Abhijeet ; Kellen, Chris ; Blanton, R.D.

Author_Institution

Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

fYear

1998

fDate

18-23 Oct 1998

Firstpage

557

Lastpage

566

Abstract

We have enhanced the process simulator CODEF (1996) into a tool called CARAMEL (Contamination And Reliability Analysis of MicroElectromechanical Layout) for analyzing the impact of contamination particles on the geometrical and material properties of microelectromechanical systems (MEMS). CARAMEL accepts as input a microelectromechanical layout, a particulate description, and a process recipe. CARAMEL produces a mesh description of the defective layout that is completely compatible with the electromechanical simulator ABAQUS (1995). Analysis of CARAMEL´s output indicates that a wide range of defective structures are possible due to the presence of contaminations. Moreover, electromechanical simulations of CARAMEL´s mesh representations of defective layout has revealed that a wide variety of faulty behaviors are associated with these defects. In this paper, we describe CARAMEL and its application to the development of realistic fault models for MEMS

Keywords

circuit simulation; digital simulation; failure analysis; fault diagnosis; integrated circuit reliability; integrated circuit testing; micromechanical devices; CARAMEL; MEMS fault model; contamination particles; defective layout; electromechanical simulator ABAQUS; geometrical properties; material properties; mesh description; microelectromechanical systems; process simulator CODEF; reliability analysis; Analytical models; Atmospheric modeling; Contamination; Design for testability; Fabrication; Materials reliability; Microelectromechanical systems; Micromechanical devices; Solid modeling; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1998. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-5093-6

Type

conf

DOI

10.1109/TEST.1998.743199

Filename

743199