• DocumentCode
    2525508
  • Title

    Research of method for voltage sag source location in power system

  • Author

    Xu Yonghai ; Gao Qianqian ; Yu Yilin ; Tao Shun ; Xiao Xiangning

  • Author_Institution
    State Key Lab. of Alternate Electr. Power Syst. with Renewable Energy Sources, North China Electr. Power Univ., Beijing, China
  • fYear
    2012
  • fDate
    17-20 June 2012
  • Firstpage
    816
  • Lastpage
    822
  • Abstract
    Four existing voltage sag source location methods based on reactive power variation, slope of the system trajectory, real current component and distance relay are analyzed and compared in this paper. The distance relay method takes advantage of measured impedance as judging criterion and shows the best performance among them. This paper proposes an improved impedance calculation method, which uses the change rate of impedance magnitude and increment of impedance angle before and during the voltage sag event to compare with a reasonable threshold. The improved method has been verified in simulated power systems with different structures, including single-supply, double-supply and ring system. Finally, an application case occurred in an actual city power system in P.R.China is given and good characteristics of the improved method are confirmed.
  • Keywords
    electric impedance measurement; power supply quality; reactive power; relay protection; P.R.China; city power system; distance relay method; double-supply ring system; impedance angle increment; impedance calculation method; impedance magnitude rate; impedance measurement; power system; reactive power variation; real current component; reasonable threshold; simulated power systems; single-supply ring system; system trajectory slope; voltage sag event; voltage sag source location method; Fault diagnosis; Monitoring; distance relay; downstream; impedance; location; upstream; voltage sag source;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Harmonics and Quality of Power (ICHQP), 2012 IEEE 15th International Conference on
  • Conference_Location
    Hong Kong
  • ISSN
    1540-6008
  • Print_ISBN
    978-1-4673-1944-7
  • Type

    conf

  • DOI
    10.1109/ICHQP.2012.6381199
  • Filename
    6381199