• DocumentCode
    2526498
  • Title

    Influence of heating on dielectric relaxation phenomena of electron beam irradiated PEEK

  • Author

    Shinyama, Katsuyoshi ; Baba, Makoto ; Fujita, Shigetaka

  • Author_Institution
    Hachinohe Inst. of Technol., Japan
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    891
  • Abstract
    Dielectric properties of non-irradiated specimen and specimens irradiated with electron beams were studied. In the temperature dependence of εr\´ and εr", the temperature at which εr\´ begins to increase and an absorption of εr" appears shifted to higher temperatures with exposure dose, and the maximum absorption (εm") was larger for the irradiated specimens. For the same specimens, εr\´ and εr" values were smaller in measurements taken the second time than in those taken the first time under the same temperature conditions. Further study revealed that εr\´ and εr" values tend to decrease over time for irradiated specimens, while those for non-irradiated specimens remained constant at the same values as noted the second time and with later measurements. A similar trend was observed for frequency dependence of εr\´ and εr" data for measurements conducted five times with the same specimens
  • Keywords
    dielectric losses; dielectric relaxation; electron beam effects; heat treatment; permittivity; polymers; dielectric losses; dielectric relaxation phenomena; electron beam irradiated PEEK; exposure dose; frequency dependence; heating; irradiated specimens; permittivity; temperature dependence; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Dielectrics and electrical insulation; Electron beams; Frequency measurement; Heating; Plastic insulation; Polymers; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    0-7803-5459-1
  • Type

    conf

  • DOI
    10.1109/ICPADM.2000.876372
  • Filename
    876372