Effect of reaction-induced phase separation on dielectric properties of epoxy resin modified with rubber

Author

Desheng, Wang ; Guanghua, Zhang ; Yajie, Zhang ; Shoutian, Chen

Author_Institution

State Key Lab. of Electr. Insulation for Power Equipment, Xi´´an Jiaotong Univ., China

Volume

2

fYear

2000

fDate

2000

Firstpage

926

Abstract

The phase separation and polymerization took place during the curing process of the epoxy resin system, which consisted of diglycidyl ether of bisphenol A and a novel liquid rubber QR. The phase structure development was investigated by scanning electron microscopy (SEM). SEM revealed that the spherical rubber domain was dispersed randomly in the cured epoxy resin matrix. The domain size changed with the content of the modified rubber QR in the system. The higher the QR content, the larger was the spherical domain. Therefore, dielectric loss (tanδ), dielectric constant (ε_r) and volume resistivity (ρ_v) of the cured resin were changed by different polarizations, especially interface polarization, which is introduced by the second rubber phase

Keywords

composite insulating materials; dielectric losses; dielectric polarisation; electrical resistivity; permittivity; phase separation; polymer blends; polymer structure; polymerisation; rubber; scanning electron microscopy; SEM; bisphenol A diglycidyl ether; curing process; dielectric constant; dielectric loss; dielectric properties; epoxy resin system; interface polarization; liquid rubber QR; phase structure development; polymerization; random dispersion; reaction-induced phase separation; rubber modified epoxy resin; scanning electron microscopy; second rubber phase; spherical domain; spherical rubber domain; volume resistivity; Composite materials; Curing; Dielectric liquids; Dielectric losses; Dielectric materials; Epoxy resins; Polarization; Production facilities; Rubber; Scanning electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on

Conference_Location

Xi´an

Print_ISBN

0-7803-5459-1

Type

conf

DOI

10.1109/ICPADM.2000.876382

Filename

876382