DocumentCode :
2527260
Title :
Micromechanical resonators for frequency references and signal processing
Author :
Howe, R.T. ; Nguyen, C.T.-C.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1994
fDate :
11-14 Dec. 1994
Firstpage :
343
Abstract :
Summary form only given, as follows. This paper reviews the application of silicon micromachining to the fabrication of electrostatically driven and capacitively sensed micromechanical resonators. These structures can be surface-micromachined from polysilicon and also, from single crystal silicon using wafer bonding and etch-back, with both technologies compatible with integration of drive and sense CMOS electronics. The potential applications of these structures to integrated frequency references, micromechanical filters and mixers are described. The passband characteristics of these resonators can be adjusted electrically. Integrated micro-ovens for temperature control have been demonstrated, as well. Finally, we assess the frequency range and prospects for micromechanical signal processing.<>
Keywords :
electrostatic devices; elemental semiconductors; etching; micromachining; micromechanical resonators; silicon; wafer bonding; CMOS electronics; Si; capacitive sensing; electrostatic drive; etch-back; frequency range; frequency references; integrated micro-ovens; micromechanical filters; micromechanical resonators; micromechanical signal processing; mixers; passband characteristics; polysilicon; silicon micromachining; temperature control; wafer bonding; CMOS technology; Etching; Fabrication; Micromachining; Micromechanical devices; Passband; Resonant frequency; Resonator filters; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-2111-1
Type :
conf
DOI :
10.1109/IEDM.1994.383398
Filename :
383398
Link To Document :
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