DocumentCode :
252769
Title :
Test methods and influencing factors for the adhesion strength measurement of metallized structures on thermoplastic substrates
Author :
Kuhn, T. ; Franke, J.
Author_Institution :
Inst. for Factory Autom. & Production Syst. (FAPS), Friedrich-Alexander Univ. Erlangen-Nuremberg (FAU), Nuremberg, Germany
fYear :
2014
fDate :
3-5 Dec. 2014
Firstpage :
655
Lastpage :
660
Abstract :
The requirements that apply to mechatronic systems regarding integration density, functionality, and miniaturization are significantly increasing. In this context molded interconnect devices (MID) offer in many cases an appropriate solution due to their spatial design freedom and versatile possibilities for functional integration. Already today, the technology is used in a wide range of application fields. Especially in safety and security relevant systems, the reliability is a crucial aspect, which is highly influenced by the adhesions strength of the metallized structures on the substrate. However, general standards or guidelines for testing MID do not exist and conventional test methods are in most cases only limited suitable for determining the adhesion strength of the metallization on molded interconnect devices. In this paper, commonly used adhesion tests are presented and assessed regarding their suitability for their use in MID. Thereby, the new hot pin pull test is introduced in detail. Comparative investigations with conventional test methods show promising results concerning reproducibility and a low standard deviation. The impact of influencing factors on the test results, such as the temperature or the wetting of the test structures with solder illustrates the importance of testing standards.
Keywords :
adhesion; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; mechanical variables measurement; mechatronics; adhesion strength measurement; hot pin pull test; mechatronic systems; metallized structures; molded interconnect devices; test methods; thermoplastic substrates; Adhesive strength; Adhesives; Conductors; Force; Force measurement; Metallization; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
Type :
conf
DOI :
10.1109/EPTC.2014.7028332
Filename :
7028332
Link To Document :
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