DocumentCode
2528577
Title
Out-of-plane axis SOI MEMS gyroscope with initially displaced vertical sensing comb
Author
Maeda, D. ; Jeong, H. ; Takubo, C. ; Degawa, M. ; Yamanaka, K. ; Shoji, M. ; Goto, Y.
Author_Institution
Central Res. Lab., Hitachi, Ltd., Tokyo, Japan
fYear
2011
fDate
5-9 June 2011
Firstpage
44
Lastpage
47
Abstract
We developed a capacitive silicon on insulator (SOI) microelectro-mechanical systems (MEMS) tuning-fork gyroscope and describe its structure and performance. The gyroscope is composed of initially displaced vertical sensing combs we developed to sense out-of-plane motion of a proof mass. The initial displacement between the movable electrodes and fixed electrodes of the vertical sensing combs is achieved simply by applying DC bias voltage between the movable sensing proof mass and the handle layer of the SOI wafer. We also employed a one-sided force feedback scheme that is easily fabricated in an SOI and resulted in ±0.5% nonlinearity.
Keywords
gyroscopes; microfabrication; microsensors; silicon-on-insulator; vibrations; DC bias voltage; capacitive silicon on insulator; initial displaced vertical sensing comb; microelectro-mechanical system tuning-fork gyroscope; movable electrodes; out-of-plane axis SOI MEMS gyroscope; Electrodes; Force; Force feedback; Gyroscopes; Micromechanical devices; Sensors; Suspensions; MEMS; feedback control; gyroscope; out-of-plane; vertical sensing comb;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969129
Filename
5969129
Link To Document