• DocumentCode
    2528577
  • Title

    Out-of-plane axis SOI MEMS gyroscope with initially displaced vertical sensing comb

  • Author

    Maeda, D. ; Jeong, H. ; Takubo, C. ; Degawa, M. ; Yamanaka, K. ; Shoji, M. ; Goto, Y.

  • Author_Institution
    Central Res. Lab., Hitachi, Ltd., Tokyo, Japan
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    44
  • Lastpage
    47
  • Abstract
    We developed a capacitive silicon on insulator (SOI) microelectro-mechanical systems (MEMS) tuning-fork gyroscope and describe its structure and performance. The gyroscope is composed of initially displaced vertical sensing combs we developed to sense out-of-plane motion of a proof mass. The initial displacement between the movable electrodes and fixed electrodes of the vertical sensing combs is achieved simply by applying DC bias voltage between the movable sensing proof mass and the handle layer of the SOI wafer. We also employed a one-sided force feedback scheme that is easily fabricated in an SOI and resulted in ±0.5% nonlinearity.
  • Keywords
    gyroscopes; microfabrication; microsensors; silicon-on-insulator; vibrations; DC bias voltage; capacitive silicon on insulator; initial displaced vertical sensing comb; microelectro-mechanical system tuning-fork gyroscope; movable electrodes; out-of-plane axis SOI MEMS gyroscope; Electrodes; Force; Force feedback; Gyroscopes; Micromechanical devices; Sensors; Suspensions; MEMS; feedback control; gyroscope; out-of-plane; vertical sensing comb;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969129
  • Filename
    5969129