Characterization of dicing tape adhesion for ultra-thin die pick-up process

We observed experimentally that the dicing tape “adhesion” increases during a mimicked die pick-up process when the die thickness decreases. This agrees apparently with the numerical results reported by B. Peng et al. in 2011. This paper describes in detail our experimental procedures and the testing results we obtained for chips ranging from 30 to 200 μm. We will report the trends we observed and subsequently, propose a model for characterizing the dicing tape adhesion using the strain energy release rate G (in [J/m²]). This may serve as a generalized criterion for the initiation of tape peeling for various chip configurations and die pick-up conditions. The current study will be important to the characterization of the “ability of being-picked” of an ultra-thin die, which remains a major reliability concern in the industry.