Mechanical strength measurement of micro anchor-beam combined structure fabricated by silicon-on-glass process

Two series of devices, bonding quality testing devices and torsional strength testing devices, were designed to fully investigate the mechanical strength of the micro anchor-beam combined structure, which is fabricated by silicon-on-glass process. It´s proved that the bonding quality of the anchor degenerates severely when the anchor size becomes very small. And the results of anodic bonding quality testing device demonstrated that array-shaped anchor design helped to improve the anodic bonding yield. According to the bending fracture test of the torsional strength testing devices, the array-shaped anchor design has an almost equal, even bigger torsional strength compared with single anchor.