Performance and reliability study of TGV interposer in 3D integration

In this work, a test vehicle of 3D stacking structure using through glass vias (TGVs) interposer as major interconnect has been designed and fabricated. Through the optimum TGV filling process for tapered via, chemical mechanical polishing (CMP) process on heterogeneous materials (glass and copper) and 3D structure assembly process, the test vehicle is successfully built and the measured electrical resistance of TGV shows fair agreement to theoretical value. After that, thermal cycling test is employed to evaluate the reliability of TGVs in the 3D structure. Results show that robust 3D stacking structure with glass interposer has been developed successfully in this study.