• DocumentCode
    2529043
  • Title

    Zero temperature coefficient gas-sealed pressure sensor using mechanical temperature compensation

  • Author

    Hao, X.C. ; Jiang, Y.G. ; Takao, H. ; Maenaka, K. ; Fujita, T. ; Higuchi, K.

  • Author_Institution
    Maenaka Human-Sensing Fusion Project, JST, Himeji, Japan
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    116
  • Lastpage
    119
  • Abstract
    A novel gas sealed capacitive pressure sensor with a self-temperature compensated structure is reported. The pressure sensor is sealed by Au-Au diffusion bonding in nitrogen with a pressure of 100 kPa and integrated with a platinum resistor based temperature sensor for human activity monitoring. A ring-shaped structure on the diaphragm of the pressure sensor is used for temperature compensation. The pressure sensor with the temperature compensation structure can mechanically suppress the thermal expansion effect of the sealed gas in cavity. Using the compensation structure, measured temperature coefficient was much reduced as compared to that of the pressure sensor without compensation. The sensitivities of the pressure sensor before and after compensation are almost same in a pressure range from 80 kPa to 100 kPa.
  • Keywords
    capacitive sensors; compensation; diaphragms; diffusion bonding; gold; monitoring; platinum; pressure sensors; resistors; temperature sensors; Au; Pt; diaphragm ring-shaped structure; diffusion bonding; human activity monitoring; mechanical temperature compensation; pressure 80 kPa to 100 kPa; resistor based temperature sensor; thermal expansion effect; zero temperature coefficient gas-sealed capacitive pressure sensor; Bonding; Capacitance; Cavity resonators; Sensitivity; Temperature measurement; Temperature sensors; Thermal expansion; Pressure sensor; gas-sealed; mechanical temperature compensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969152
  • Filename
    5969152