Title :
Direct BSIM3v3 parameter extraction for hot-carrier reliability simulation of N-channel LDD MOSFETs
Author :
Minehane, Seán ; Healy, Sharon ; O´Sullivan, Paula ; McCarthy, Kevin ; Mathewson, Alan ; Mason, Barry
Author_Institution :
Nat. Microelectron. Res. Centre, Cork, Ireland
Abstract :
A novel direct parameter extraction strategy for the BSIM3v3 MOSFET model, and its application to hot-carrier reliability simulation, is presented in this paper. The use of direct extraction procedures allows a very fast extraction of circuit reliability parameters, with a minimum of measurements, and produces physically relevant parameters. The extraction routines presented are based on the device equations of BSIM3vS, and the use of a direct scheme over an optimised scheme makes the extraction routines repeatable over a wide range of experimental conditions. The more common commercial reliability simulators available in the industrial market generate predicted parameter sets after selected durations of device operation by interpolation (or extrapolation) between measured parameter sets extracted at intervals, during a constant-bias stress. The work presented here suggests that confidence in the predicted circuit performance is dependent on very careful choice of both the parameter sets supplied to the reliability simulator, and the applied stressing conditions
Keywords :
CMOS integrated circuits; MOSFET; SPICE; carrier mobility; circuit analysis computing; digital simulation; hot carriers; integrated circuit modelling; integrated circuit reliability; semiconductor device models; semiconductor device reliability; BSIM3v3 MOSFET model; NMOSFET; applied stressing conditions; circuit reliability parameters; device equations; direct BSIM3v3 parameter extraction; hot-carrier reliability simulation; n-MOSFETs; n-channel LDD MOSFETs; parameter sets; Circuit optimization; Circuit simulation; Equations; Extrapolation; Hot carriers; Interpolation; MOSFET circuits; Parameter extraction; Predictive models; Stress measurement;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638176