DocumentCode
2532216
Title
Thermal design of an HTP microthruster
Author
Halswijk, Whc ; Moerel, Jlpa ; Sanders, Hm
Author_Institution
TNO Defence Security & Safety, Netherlands
fYear
2005
fDate
24-27 July 2005
Firstpage
143
Lastpage
144
Abstract
A microscale thruster, has been successsfully designed using MEMS technology, in that ´stacked wafer´ design is adopted.The thruster is built up of stacked and bonded silicon wafer, each with its own internal structure. The MEMS technology as succeed in acheiveing good performance and relatively short heat-up transient. This paper describes the preliminary design and detailed thermal analysis. The microthruster is designed to be used on small satellites,to deliver small impulse bits micro/nano-satellites for δV impulses.
Keywords
aerospace propulsion; micromechanical devices; propellers; thermal analysis; wafer bonding; MEMS monopropellant microthruster; MEMS technology; bonded silicon wafer; high test peroxyde microthruster designing; internal structure; short heat-up transient; stacked wafer; thermal analysis; thermal design; Assembly; Chemical analysis; Fabrication; Fasteners; Feeds; Ignition; Micromechanical devices; Propulsion; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN
0-7695-2398-6
Type
conf
DOI
10.1109/ICMENS.2005.124
Filename
1540800
Link To Document