DocumentCode :
2532438
Title :
Micro systems technology: the way to shrink sun sensors
Author :
Leijtens, Johan ; de Boom, Kees ; van der Heiden, Nico
Author_Institution :
TNO Sci. & Ind., Delft, Netherlands
fYear :
2005
fDate :
24-27 July 2005
Firstpage :
193
Lastpage :
194
Abstract :
High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.
Keywords :
micromachining; microsensors; silicon radiation detectors; sunlight; wafer bonding; aperture masks; bulk micromachining; microsystem technology; silicon detectors; sunsensors; surface micromachining; wafer level bonding; Apertures; Costs; Detectors; Earth; Micromachining; Sensor arrays; Sensor systems; Silicon; Sun; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN :
0-7695-2398-6
Type :
conf
DOI :
10.1109/ICMENS.2005.68
Filename :
1540813
Link To Document :
بازگشت