DocumentCode :
2534472
Title :
Very high temperature (800°C) ohmic contact of Au/Ni2Si on n-type polycrystalline silicon carbide aged in air
Author :
Larger, R. ; Frechette, L.G.
Author_Institution :
Dept. of Mech. Eng., Univ. de Sherbrooke, Sherbrooke, QC, Canada
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
2879
Lastpage :
2882
Abstract :
Ohmic and low-resistance electrical contacts on silicon carbide have been demonstrated for the first time up to very high temperature (800°C) in an oxidizing environment. A specific contact resistance of about 2 × 10-4 Ω.cm2 was achieved after silicidation at 900°C. Long term aging tests in an oxygen atmosphere were performed, demonstrating ohmic behavior up to 1000 h at 550°C and over 4 h at 800°C. The aging mechanism has been explained, suggesting that polycrystalline 3C-SiC is not as stable as expected at very high temperatures, acting as a source for Si out-diffusion. Also, in-situ electrical measurements at very high temperatures in air using the transmission line method (L-TLM) have been achieved demonstrating good performance of the proposed metallization at representative operating conditions for harsh environments.
Keywords :
chemical analysis; contact resistance; gold; metallisation; nickel alloys; ohmic contacts; silicon compounds; temperature measurement; thermal stability; Au-Ni2Si; SiC; long term aging tests; low-resistance electrical contacts; n-type polycrystalline silicon carbide; oxygen atmosphere; specific contact resistance; temperature 550 degC; temperature 800 degC; temperature 900 degC; transmission line method; very high temperature ohmic contact; Gold; Nickel; Oxidation; Silicon; Silicon carbide; Temperature measurement; Thyristors; SiC; formation mechanism; ohmic contact; oxidation; silicon diffusion; transition metal silicides;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969471
Filename :
5969471
Link To Document :
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