DocumentCode :
2534976
Title :
Heated membranes prevent clogging of apertures in nanostencil lithography
Author :
Xie, S.Q. ; Savu, V. ; Brugger, J.
Author_Institution :
Microsyst. Lab., Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
998
Lastpage :
1001
Abstract :
We demonstrate a novel concept for nanostencil lithography with an integrated microhotplate on the stencil membrane aimed at eliminating or reducing aperture clogging during metal deposition. The stencil can be locally heated up by the embedded Pt coils to more than 700°C in order to minimize materials´ accumulation on the membrane. FEM simulation was carried out to predict the temperature distribution across the heated membrane, which agrees well with the experimental results in ambient conditions. 120 nm Aluminum depositions through heated and non-heated stencils were performed simultaneously in an electron-beam evaporator. No clogging was found on the heated membrane whereas a clear shrinkage of the aperture was observed on the non-heated one. This method could significantly extend the life time of the stencil, especially for thick deposited layers, e.g.in the dynamic mode.
Keywords :
electric heating; nanolithography; temperature distribution; vapour deposition; FEM simulation; apertures; clogging; electron-beam evaporator; heated membranes; integrated microhotplate; metal deposition; nanostencil lithography; stencil membrane; temperature distribution; Apertures; Coils; Heating; Optical imaging; Substrates; Temperature measurement; Stencil lithography; clogging; embedded electrodes; heated membranes; microhotplate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969501
Filename :
5969501
Link To Document :
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