DocumentCode :
2535388
Title :
Hermetic packaging of resonators with vertical feedthroughs using a glass-in-silicon reflow process
Author :
Haque, R.M. ; Serrano, D.E. ; Gao, X. ; Shirazi, A.N. ; Keesara, V. ; Ayazi, F. ; Wise, K.D.
Author_Institution :
Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
2303
Lastpage :
2306
Abstract :
A low-cost, hermetic wafer-level packaging solution with negligible parasitics suitable for MEMS resonators is presented. A glass cap with embedded 50μm diameter vertical single-crystal silicon feedthroughs is anodically bonded in vacuum to an SOI wafer prefabricated with mechanical resonators. This hermetic packaging process provides virtually zero-parasitic-capacitance vertical interconnects. A silicon-gold eutectic is used to ensure electrical contacts between the feedthroughs and the device wafer. An embedded wet-etched cavity in the glass cap allows mechanical motion of the resonator as well as the inclusion of a thin-film getter to further enhance and maintain vacuum. Temperature sweeps and quality factor measurements demonstrate the successful packaging of resonators using this technique.
Keywords :
electric connectors; electrical contacts; etching; eutectic alloys; glass; gold alloys; hermetic seals; interconnections; micromechanical resonators; silicon; silicon alloys; wafer level packaging; MEMS resonators; SOI wafer; Si; Si-Au; anodic bonding; electrical contact; embedded wet etched cavity; eutectic; glass cap; glass-in-silicon reflow process; hermetic packaging; hermetic wafer level packaging; mechanical resonator; size 50 mum; thin film getter; vertical feedthrough; vertical single crystal silicon feedthrough; zero parasitic capacitance vertical interconnect; Cavity resonators; Gettering; Glass; Resonant frequency; Silicon; Temperature; Temperature measurement; Anodic; Glass; Glass Reflow; Resonator; Vertical Feedthroughs; Wafer-Level Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969539
Filename :
5969539
Link To Document :
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