Title :
IEEE Compound Semiconductor Integrated Circuit Symposium. 2004 IEEE CISC Symposium (IEEE Cat. No.04CH37591)
Abstract :
The following topics are dealt with: wireless base station technology; 3D microsystems; elemental semiconductors; SiGe HBT technology; GaN HEMTs; mixed signal circuits and technology; high speed data converters; CMOS; III-V semiconductors; integrated PA module packaging; optical systems; FETs; power amplifiers; signal generation; switching ICs; advanced silicon transceiver ICs; high power technologies; mixers and multipliers; millimeter wave technology; MMIC technology and semiconductor device modeling.
Keywords :
CMOS integrated circuits; III-V semiconductors; MMIC; data conversion; elemental semiconductors; field effect transistors; heterojunction bipolar transistors; integrated circuit packaging; micromechanical devices; millimetre wave circuits; mixed analogue-digital integrated circuits; mixers (circuits); mobile communication; multiplying circuits; power amplifiers; power integrated circuits; semiconductor device models; signal generators; switching circuits; transceivers; 3D microsystems; CMOS; FETs; GaN HEMTs; III-V semiconductors; MMIC technology; SiGe HBT technology; advanced silicon transceiver Ics; elemental semiconductors; high power technologies; high speed data converters; integrated PA module packaging; millimeter wave technology; mixed signal circuits; mixers; multipliers; optical systems; power amplifiers; semiconductor device modeling; signal generation; switching Ics; wireless base station technology;
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-8616-7
DOI :
10.1109/CSICS.2004.1392455