Title :
A novel model for on-chip heat dissipation
Author :
Chiueh, Herming ; Draper, Jeffrey ; Luh, Louis ; Chom, John, Jr.
Author_Institution :
Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
Abstract :
This paper presents an analytical model for on-chip heat dissipation in VLSI design. A chip and its test configuration also are developed to verify modeling results. The model and chip are representative of general IC packages. Our research shows that circuit location on a chip determines its default offset temperature and heat transport properties, which must be considered for accurate prediction of junction temperature and electrothermal analysis. The model yields insights about on-chip heat dissipation, which are very useful for mixed-signal VLSI designs and circuit reliability analysis
Keywords :
VLSI; cooling; integrated circuit design; integrated circuit modelling; integrated circuit packaging; temperature distribution; thermal analysis; IC packages; VLSI design; analytical model; circuit location; circuit reliability analysis; default offset temperature; electrothermal analysis; heat transport properties; junction temperature prediction; mixed-signal VLSI; on-chip heat dissipation; test configuration; Analytical models; Circuit analysis; Circuit testing; Differential equations; Heat transfer; Integrated circuit modeling; Isothermal processes; Packaging; Temperature distribution; Very large scale integration;
Conference_Titel :
Circuits and Systems, 1998. IEEE APCCAS 1998. The 1998 IEEE Asia-Pacific Conference on
Conference_Location :
Chiangmai
Print_ISBN :
0-7803-5146-0
DOI :
10.1109/APCCAS.1998.743937