• DocumentCode
    2537294
  • Title

    Ni-based microvalves for flow modulation: Toward active combustion control

  • Author

    Chang, C.W. ; Okojie, R.S.

  • Author_Institution
    ASRC Aerosp. Corp., Cleveland, OH, USA
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    2434
  • Lastpage
    2437
  • Abstract
    We report on the development of nickel-based micro diaphragms for fluid flow modulation in aerospace applications. We fabricated, assembled, and tested these nickel-based micro diaphragms in a prototype mesoscale fuel injector. A combination of deep reactive etching, silicon loss molding, electroplating, and conventional machining techniques were applied to form the mesoscale fuel injector and the nickel diaphragms. Modulation of fluid flow through the fuel injector was demonstrated with this nickel diaphragm functioning as a valve. The nickel diaphragms were characterized and the measured results were compared with finite element analysis results. The primary goal of this work is to demonstrate the concept of flow modulation using a nickel-based diaphragm, with future generations to be produced in silicon carbide, and the future application of such technologies in active combustion control to mitigate combustion instabilities when they occur.
  • Keywords
    electroplating; finite element analysis; flow; fuel systems; microactuators; microfabrication; microvalves; nickel; active combustion control; aerospace applications; conventional machining techniques; deep reactive etching; electroplating; finite element analysis; fluid flow modulation; microvalves; prototype mesoscale fuel injector; silicon loss molding; Combustion; Fluids; Fuels; Nickel; Pressure measurement; Silicon carbide; Valves; Microvalve; Ni; combustion control; diaphragm; finite element analysis; microactuator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969659
  • Filename
    5969659