Title :
Recent progress in packaging of RF MEMS
Author_Institution :
Adv. Device Lab., OMRON Corp., Kyoto, Japan
Abstract :
RF MEMS devices utilized micromachining technologies offer a high performance to several RF applications. However packaging for devices have reduced performance problem when integrated to another RF devices. This paper reviews the recent progress in packaging of RF MEMS especially switching devices. And, a novel method of wafer level packaging for RF-MEMS switch was described.
Keywords :
micromachining; micromechanical devices; microwave switches; packaging; RF MEMS devices; RF MEMS packaging; frit glass; micromachining technologies; switching devices; wafer level packaging; Actuators; Contacts; Electrodes; Glass; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Wafer scale integration;
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE
Print_ISBN :
0-7803-8616-7
DOI :
10.1109/CSICS.2004.1392547
