Title :
AFFCCA: a tool for critical area analysis with circular defects and lithography deformed layout
Author :
Bubel, Igor ; Maly, Wojciech ; Waas, Thomas ; Nag, Pranab K. ; Hartmann, Hans ; Schmitt-Landsiedel, Doris ; Griep, Susanne
Author_Institution :
Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
Abstract :
This paper describes the AFFCCA (Accurate, Fast, Flexible Computation of Critical Area) tool. The algorithms implemented in AFFCCA can handle arbitrary geometry, defects causing shorts of arbitrary shapes, and a spectrum of process induced layout deformations. The presented results indicate that the unique features of AFFCCA allow for significant improvements in the accuracy of critical area computations
Keywords :
circuit layout CAD; integrated circuit layout; lithography; AFFCCA; IC critical area computations; circular defects; critical area analysis tool; lithography deformed layout; process induced layout deformations; Conducting materials; Costs; Geometry; Integrated circuit layout; Lithography; Manufacturing; Research and development; Shape; Solid state circuits; Yield estimation;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 1995. Proceedings., 1995 IEEE International Workshop on,
Conference_Location :
Lafayette, LA
Print_ISBN :
0-8186-7107-6
DOI :
10.1109/DFTVS.1995.476932
