The evolution of MMIC packaging

Author

Kuno, H.J. ; Midford, T.A. ; Wooldridge, J.J.

Author_Institution

Hughes Aircraft Co., Torrance, CA, USA

fYear

1993

fDate

June 28 1993-July 2 1993

Firstpage

1005

Abstract

The authors outline current evolution in MMIC (monolithic microwave integrated circuit) packaging through a series of examples of newly emerging technologies and products, the latter chosen primarily from active array radar. Using active array modules as an example, it is possible to project some future development trends. The longer-term trends include a continued emphasis on higher levels of packaging integration, increased use of batch fabrication and testing, reduced parts count, more automated and simpler assembly processes (fewer wire bonds), and more accurate, faster, and user-friendly package design and simulation tools.<>

Keywords

MMIC; active antenna arrays; batch processing (industrial); integrated circuit manufacture; integrated circuit packaging; integrated circuit testing; microassembling; radar antennas; technological forecasting; MMIC packaging; active array radar; assembly processes; future development trends; monolithic microwave integrated circuit; package design; packaging integration; parts count; simulation tools; Automatic testing; Fabrication; Integrated circuit packaging; Integrated circuit technology; MMICs; Microwave antenna arrays; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits; Radar;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1993. AP-S. Digest

Conference_Location

Ann Arbor, MI, USA

Print_ISBN

0-7803-1246-5

Type

conf

DOI

10.1109/APS.1993.385179

Filename

385179