DocumentCode
2546167
Title
Delay Uncertainty Reduction by Interconnect and Gate Splitting
Author
Agarwal, Vineet ; Sun, Jin ; Mitev, Alexander ; Wang, Janet
Author_Institution
Electr. & Comput. Eng. Dept., Arizona Univ., Tucson, AZ
fYear
2007
fDate
23-26 Jan. 2007
Firstpage
690
Lastpage
695
Abstract
Traditional timing variation reduction techniques are only able to decrease the gate delay variation by incurring a delay overhead. In this work, we propose novel and effective splitting based variation reduction techniques for both interconnect and gate. We developed a new tool called TURGIS: timing uncertainty reduction by gate-interconnect splitting which reduces the timing variations of a circuit and presents little delay overhead at the primary output. It is shown that using splitting on interconnect can reduce the chemical-mechanical polishing (CMP) induced dishing effect and can result in decrease at an average of 5% in mean interconnect delay in addition to its variation. Improvements of up to 30% are achieved on timing variation for gates of various size while reduction of 55% can be observed in interconnect delay variation.
Keywords
chemical mechanical polishing; delays; integrated circuit interconnections; CMP; chemical-mechanical polishing; delay uncertainty reduction; gate splitting; interconnect delay variation; interconnect splitting; splitting based variation reduction techniques; timing uncertainty reduction by gate-interconnect splitting; Added delay; Chemicals; Costs; Delay effects; Digital circuits; Integrated circuit interconnections; Manufacturing processes; Sun; Timing; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2007. ASP-DAC '07. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
1-4244-0629-3
Electronic_ISBN
1-4244-0630-7
Type
conf
DOI
10.1109/ASPDAC.2007.358067
Filename
4196113
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