• DocumentCode
    2546167
  • Title

    Delay Uncertainty Reduction by Interconnect and Gate Splitting

  • Author

    Agarwal, Vineet ; Sun, Jin ; Mitev, Alexander ; Wang, Janet

  • Author_Institution
    Electr. & Comput. Eng. Dept., Arizona Univ., Tucson, AZ
  • fYear
    2007
  • fDate
    23-26 Jan. 2007
  • Firstpage
    690
  • Lastpage
    695
  • Abstract
    Traditional timing variation reduction techniques are only able to decrease the gate delay variation by incurring a delay overhead. In this work, we propose novel and effective splitting based variation reduction techniques for both interconnect and gate. We developed a new tool called TURGIS: timing uncertainty reduction by gate-interconnect splitting which reduces the timing variations of a circuit and presents little delay overhead at the primary output. It is shown that using splitting on interconnect can reduce the chemical-mechanical polishing (CMP) induced dishing effect and can result in decrease at an average of 5% in mean interconnect delay in addition to its variation. Improvements of up to 30% are achieved on timing variation for gates of various size while reduction of 55% can be observed in interconnect delay variation.
  • Keywords
    chemical mechanical polishing; delays; integrated circuit interconnections; CMP; chemical-mechanical polishing; delay uncertainty reduction; gate splitting; interconnect delay variation; interconnect splitting; splitting based variation reduction techniques; timing uncertainty reduction by gate-interconnect splitting; Added delay; Chemicals; Costs; Delay effects; Digital circuits; Integrated circuit interconnections; Manufacturing processes; Sun; Timing; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2007. ASP-DAC '07. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    1-4244-0629-3
  • Electronic_ISBN
    1-4244-0630-7
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2007.358067
  • Filename
    4196113