Numerical analysis on the thermal performance of chilled ceiling panels using encapsulated phase change material

A chilled ceiling panel using PCM is developed. Study has research on its thermal performance and analysis on heat transfer mechanism. Phase change process of PCM has three stages, solid Mushy and Liquid. Mathematic model is built for the cool room and simulation is made to evaluate the thermal performance. Contact thermal resistance and conduction shape factor are taken into consideration. Existence of air gap between PCM and aluminum plate largely decreases the heat conduction coefficient, which has great influence on the stability of the cool room temperature and phase change time. Heat load of conduction shape factor constitutes major part of total heat load. Simulation gives the high accuracy of trend of PCM ceiling thermal performance. When structure determined, refrigerant temperature Tin, environmental Ten, air velocity v have influence on performance of PCM ceiling, but the influence degrees are different, according to the single factor changing experiment and orthogonal design analysis for multi-factors influence which are taken.