DocumentCode
2557663
Title
The SOPC-based ASF600 wireless temperature measuring system
Author
Jun, Liu ; Yongqiang, Chen ; Mingxin, Yang
Author_Institution
Chengdu Univ. of Inf. Eng., Chengdu, China
fYear
2010
fDate
16-18 April 2010
Firstpage
612
Lastpage
616
Abstract
High-voltage power system equipment has the following problems during the long-running process: surface oxidation and corrosion, fastening bolt losing, the junction between contact and bus row is aging etc. They make the equipment is very hot, even produce the serious accident. And there is high-voltage exposed in the switchgear, the space is very small, so manual temperature measurement is impossible, the traditional temperature measurement method can´t solve this problem effectively. This paper introduce a kind of wireless temperature measurement system, it installs the temperature sensors to the charged contact in the switchgear. After measuring the temperature on-line, upload the data with the wireless type, display them, and realize the over-temperature alarm. The system can be connected with automatic system, users can remotely monitor the running state of the equipment temperature. Once equipment temperature abnormal appears, the system can automatically and remotely alarm, and get rid of the hidden danger of accidents in time.
Keywords
switchgear; temperature measurement; temperature sensors; SOPC-based ASF600; bolt losing; bus row; equipment temperature remote monitoring; high-voltage power system equipment; online temperature measurement; over-temperature alarm; surface corrosion; surface oxidation; switchgear; temperature sensors; wireless temperature measuring system; Accidents; Corrosion; Fasteners; Joining processes; Oxidation; Power system measurements; Switchgear; Temperature measurement; Temperature sensors; Wireless sensor networks; ASF600; SOPC; thermal resistance; wireless measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Management and Engineering (ICIME), 2010 The 2nd IEEE International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-5263-7
Electronic_ISBN
978-1-4244-5265-1
Type
conf
DOI
10.1109/ICIME.2010.5478237
Filename
5478237
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