DocumentCode :
2557677
Title :
SF6 gas breakdown at low temperature
Author :
Fréchette, Michel F.
Author_Institution :
IREQ, Varennes, Que., Canada
fYear :
1990
fDate :
3-6 Jun 1990
Firstpage :
229
Lastpage :
235
Abstract :
The low-temperature breakdown behavior of compressed SF6 is reviewed, the scope of the investigation being limited by experimental conditions which correspond to a gas state of the insulating medium. A thermodynamic model has been developed taking into account the nonideal gas behavior associated with compressed gas conditions and a low-temperature environment. The accuracy of the thermodynamic model was checked successfully by comparing predicted and measured dew points for SF6 and mixtures with N2. A brief analytical review of a rather sparse set of low-temperature breakdown data in SF6 shows that the low-temperature environment has a definite effect on gas-breakdown behavior; in some circumstances, the effect is large enough to require practical modifications. Some of the data obtained are analyzed in the framework of compressed-gas discharge phenomenology in order to link this temperature dependence of breakdown with some underlying active mechanisms
Keywords :
electric breakdown of gases; gas mixtures; gaseous insulation; nitrogen; sulphur compounds; SF6 gas breakdown; SF6-N2 mixtures; active mechanisms; compressed SF6; compressed gas conditions; compressed-gas discharge phenomenology; dew points; gas state; gas-breakdown behavior; low-temperature breakdown behavior; low-temperature breakdown data; low-temperature environment; nonideal gas behavior; temperature dependence of breakdown; thermodynamic model; Atmosphere; Circuit testing; Data analysis; Electric breakdown; Equations; Occupational stress; Phase measurement; Sulfur hexafluoride; Temperature distribution; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1990., Conference Record of the 1990 IEEE International Symposium on
Conference_Location :
Toronto, Ont.
ISSN :
1089-084X
Type :
conf
DOI :
10.1109/ELINSL.1990.109747
Filename :
109747
Link To Document :
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