DocumentCode
25587
Title
Silicon-based, low-g microelectromechanical systems inertial switch for linear acceleration sensing application
Author
Zhuang Xiong ; Fengtian Zhang ; Yingdong Pu ; Bin Tang ; Jie Yang ; Chao Wang
Author_Institution
Inst. of Electron. Eng., China Acad. of Eng. Phys., Mianyang, China
Volume
10
Issue
7
fYear
2015
fDate
7 2015
Firstpage
347
Lastpage
350
Abstract
Most of the microelectromechanical systems inertial switches developed in recent years are intended for shock and impact sensing above 40 g. These switches are fabricated based on non-silicon surface micromachining with multiple steps of electroplating. In this reported work, a silicon-based low-g inertial switch typically used for linear acceleration sensing was conceived, designed and fabricated. The developed inertial switch consists of a high volume proof mass and low stiffness spiral spring, and is fabricated in a specially designed double-buried layer silicon-on-insulator wafer, with standard silicon micromachining. The measurement results show that the threshold value is about 7.42 g and the stiffness is about 1.5 N/m, in accordance with the finite element method calculation.
Keywords
electroplating; elemental semiconductors; finite element analysis; micromachining; microswitches; silicon; Si; electroplating; finite element method calculation; impact sensing; linear acceleration sensing; microelectromechanical systems inertial switch; non-silicon surface micromachining; shock sensing; silicon micromachining; silicon-based low-g inertial switch; silicon-on-insulator wafer;
fLanguage
English
Journal_Title
Micro & Nano Letters, IET
Publisher
iet
ISSN
1750-0443
Type
jour
DOI
10.1049/mnl.2015.0059
Filename
7166512
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