• DocumentCode
    25587
  • Title

    Silicon-based, low-g microelectromechanical systems inertial switch for linear acceleration sensing application

  • Author

    Zhuang Xiong ; Fengtian Zhang ; Yingdong Pu ; Bin Tang ; Jie Yang ; Chao Wang

  • Author_Institution
    Inst. of Electron. Eng., China Acad. of Eng. Phys., Mianyang, China
  • Volume
    10
  • Issue
    7
  • fYear
    2015
  • fDate
    7 2015
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    Most of the microelectromechanical systems inertial switches developed in recent years are intended for shock and impact sensing above 40 g. These switches are fabricated based on non-silicon surface micromachining with multiple steps of electroplating. In this reported work, a silicon-based low-g inertial switch typically used for linear acceleration sensing was conceived, designed and fabricated. The developed inertial switch consists of a high volume proof mass and low stiffness spiral spring, and is fabricated in a specially designed double-buried layer silicon-on-insulator wafer, with standard silicon micromachining. The measurement results show that the threshold value is about 7.42 g and the stiffness is about 1.5 N/m, in accordance with the finite element method calculation.
  • Keywords
    electroplating; elemental semiconductors; finite element analysis; micromachining; microswitches; silicon; Si; electroplating; finite element method calculation; impact sensing; linear acceleration sensing; microelectromechanical systems inertial switch; non-silicon surface micromachining; shock sensing; silicon micromachining; silicon-based low-g inertial switch; silicon-on-insulator wafer;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2015.0059
  • Filename
    7166512